| 洪嘉聪 |
洪嘉聪，现任联华电子董事会主席，兼任首席战略官。洪先生毕业于淡江大学会计系，于1991年加入联电团队并曾任职于联电企业理财、信用管理暨财务部经理、财务长与财务高级副总裁。2004年，洪先生被Institutional Investor选为亚洲半导体业最佳首席财务官。洪先生同时兼任联相光电董事会主席。 |
| SC Chien |
SC Chien currently serves as UMC's Co-President, in charge of the core manufacturing and technology aspects of UMC including R&D and operations.
Mr. Chien has more than 30 years of semiconductor R&D experience. He joined UMC in 1989, and throughout his years at the company, he has led multiple functions including ATD (advanced tech development), STD (specialty tech development), CE (customer engineering), TTD (technology transfer and development), IPDS (IP & design support) and CM (Corporate marketing). Prior to his current position, Mr. Chien was UMC’s Senior Vice President.
During his career, Mr. Chien has authored 21 tech publications and holds 176 semiconductor related patents worldwide. In 1998, he earned the National Innovation Award issued by MOEA, and later won CPMA's National R&D Manager Excellence Award in 2001. |
| 孙世伟 |
孙世伟，联华电子董事会副主席。孙博士先前担任联华电子首席执行官，于首席执行官职务之前为营运长，负责12英寸晶圆厂的营运与业务。孙博士于1995年加入联电，先后负责联电6A、8AB与8D晶圆厂与中央研发部的营运。在加入联电之前，孙博士曾在摩扥罗拉公司先进产品研发实验室工作10年。于1985年获得美国西北大学材料科学博士。1995到2000年间，孙博士并曾担任国际电子组件大会（International Electron Device Meeting, IEDM）的委员、主席及亚洲共同主席等职务。 |
| Jason Wang |
Jason Wang currently serves as UMC’s Co-President, in charge of the company’s business aspects including corporate strategy & planning, sales & marketing, and customer engineering.
Mr. Wang joined UMC as Vice President of Corporate Marketing in 2008, and from 2009 to 2014, served as President of UMC-USA, responsible for business operation efficiency enhancement and UMC North American strategic business development. He was appointed to UMC Senior Vice President in November 2014, where he served until his current position as President.
Before joining UMC, Mr. Wang spent 18 years at Trident Microsystems in numerous leadership positions. Mr. Wang was named vice president of Trident's Business Operations and Finance (Asia) after leading the company's strategic restructuring plan in 2003 to transform from a PC Graphics to a Digital Media company, increasing its enterprise value by $2 billion in 2006. |
| 颜博文 |
颜博文，现任联华电子首席执行官兼董事，此前曾任资深副总经理，负责12吋晶圆厂营运。在1986年加入联电团队之后，曾先后担任8AB、8C晶圆厂厂长与新加坡UMC-SG副总经理。颜先生拥有台湾清华大学化学工程学士学位，国立台湾大学化学工程硕士学位。 |
| 陈文洋 |
陈文洋，联华电子首席运营官兼董事，台湾中央大学物理系学士，台湾交通大学电子研究所硕士。 曾任联华电子资深副总经理，负责8英寸(含6英寸)与12英寸晶圆厂的营运。历经迪吉多计算机、通用器材等公司，陈先生于1980年加入联电团队，先后担任联电 6A、8AB、8E、8D 及 8F 晶圆厂厂长，专精于半导体制程发展整合及工厂管理。 |
